课程目录:物联网无线与云计算新兴技术培训
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          物联网无线与云计算新兴技术培训

 

 

WEEK 1
IoT Business & ProductsThe first module “IoT Business & Products” focuses on the
influence of IoT and provides an overview of the trends in North America and the world’s IoT market and industry.
The differences in IoT products and services are also described followed by an introduction of the types of leading
IoT companies and products, which include Atmel,
Android Things, Samsara, ZingBox, and Uber. In addition,
IoT services types (i.e., M2M, M2P, P2M, P2P) and their economic impact and the advantages
of IoT applications as well as the IoT & M2M ecosystem are introduced.
WEEK 2
IoT Architecture & Technologies
The second module “IoT Architecture & Technologies” focuses on the functionality and characteristics of the
IoT architecture layers as well as the characteristics of IoT technologies, which include WSN (Wireless Sensor
Networks), IoT cloud computing, IoT R&D (Research & Development),
and IoT hardware technologies. Further details are provided in the descriptions of the characteristics of IoT sensors types,
actuator types, and RFID types as well as the functionality and characteristics of IoT device platforms,
which include the Arduino, Raspberry Pi, and BeagleBoard products. Next,
a comparison of the representative IoT developer platform products is presented,
which include the Raspberry Pi, Raspberry Pi 3 Model B, BeagleBoard, Beaglebone Black,
and the Arduino systems Uno R3 (for entry and general purpose), Yun (for IoT), and Lilypad (for wearable).
WEEK 3
IoT NetworksThe third module “IoT Networks” focuses on the functionality and characteristics of IoT wireless networks,
the IoT network architecture, and wearable IoT networks.
To describe the frequency requirements, the characteristics and requirements of the ISM (Industrial,
Scientific and Medical) band are introduced. Next,
the functionality and characteristics of IoT wireless communication technologies based on WLAN (Wireless Local Area Network),
WPAN (Wireless Personal Area Network),
and LPWAN (Low-Power Wide Area Network) are described.
Then further details on WPAN (which include Bluetooth, ZigBee,
6LoWPAN, and IEEE 802.15.4 technology) and LPWAN (which include LoRa, UNB, Sigfox, and NB-IoT) are provided.
In addition, the advantages of IoT and 5G mobile communication networks and the characteristics of mMTC (massive MTC) is covered.
WEEK 4
Wi-Fi & BluetoothThe fourth module “Wi-Fi & Bluetooth” focuses on the details of Wi-Fi and Bluetooth technology. First,
Wi-Fi technology and the WLAN (Wireless Local Area Network) market is introduced, followed by a description
of the functionality of Wi-Fi transmission modes (which include
the Infrastructure mode and the Ad-Hoc mode) and wireless APs (Access Points) as well as BSS (Basic Service Set) and
ESS (Extended Service Set) network formations. The internal process
of Wi-Fi operations and role of DCF (Distributed Coordination Function)
and CSMA/CA (Carrier-Sense Multiple Access with Collision Avoidance) are described followed by the characteristics
of Wi-Fi standards (which include the IEEE 802.11a, 11b, 11e, 11g, 11n, 11p, 11ac, 11ad, 11ah specifications),
Wi-Fi PHY (Physical Layer) modulation schemes, as well as the IFS (Inter-Frame Space) types and how
IFSs are used in priority access control. In addition, the advantages of Wi-Fi Dual Band and Wi-Fi Direct are introduced. Second,
Bluetooth standards and feature evolution are introduced,
which include the specifications from 1.1 to 5 including EDR (Enhanced Data Rate),
HS (High Speed), BLE (Bluetooth Low Energy), and Beacon technology.
The description incudes the characteristics of Bluetooth piconets and types
of operations (which include Classic Bluetooth and BLE (Bluetooth Low Energy))
as well as the channel specifications, advertising, and connection events.
WEEK 5
Cloud TechnologyThe fifth module “Cloud Technology” focuses on the Cloud market analysis,
Cloud service types, MCC (Mobile Cloud Computing), and Edge Computing technology.
Frist, the characteristics of the world’s top cloud companies and their services including AWS (Amazon Web Service),
Microsoft, IBM, Google, and Apple's iCloud are introduced.
Then the characteristics of cloud models, which include public cloud, private cloud,
community cloud, and hybrid cloud are described along with the differences in cloud service models,
which include SaaS (Software as a Service), PaaS (Platform as a Service), and IaaS (Infrastructure as a Service).
Based on the service models, the benefits and characteristics of Cloud services are introduced.
More details on the operation process are introduced, which include the IaaS and VM (Virtual Machine) administration,
PaaS Runtime Environment for application support, and Open SaaS applications access processes.
Then the relation between IoT and state-of-the-art mobile cloud technology is introduced. First the differences
in MCC (Mobile Cloud Computing) and Edge Computing are described, which includes details on Fog computing,
MEC (Mobile Edge Computing), and Cloudlet technology. In addition,
the functionality and characteristics of the Cloudlet architecture and its 3 layers are covered.
WEEK 6
IoT Bluetooth & Wi-Fi and EC2 Cloud ProjectsThe sixth module “IoT Bluetooth & Wi-Fi & AWS EC2 Project”
focuses on three IoT projects to provide experience in Bluetooth,
Wi-Fi, and AWS (Amazon Web Service) EC2 (Elastic Compute Cloud) system details.
The first project provides experience on the operation process of Bluetooth in Android and iPhone smartphones,
teaching how to scan a Bluetooth packet and identify different Bluetooth versions being used on a smartphone.
The second project provides experience on the operation process of Wi-Fi in Android and iPhone smartphones,
teaching how to use a Wi-Fi network analyzer, conduct a LAN scan, send ping to a gateway, conduct a Wi-Fi signal scan,
and use a Wi-Fi channel graph. The third project provides experience on how to setup
an EC2 (Elastic Compute Cloud) Virtual Computer
in AWS (Amazon Web Service) and how to use various options and compute a process on EC2 and use S3.